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The 26th Asia and South Pacific Design Automation Conference
Author Index


Table of Contents:   A  B  C  D  E  F  G  H  I  J  K  L  M  N  O  P  Q  R  S  T  U  V  W  X  Y  Z  

A

Abadal, Sergi (Univ. Politècnica de Catalunya)   p. 806 (9B-2)
Abdo, Ibrahim (Tokyo Inst. of Tech.)   p. 3 (1A-2)
Aguiar, Glaucimar (Hewlett Packard Enterprise)   p. 372 (4D-1)
Ahuja, Vipul (Qualcomm Technologies Inc)   p. 690 (7E-1)
Akita, Junichi (Kanazawa Univ.)   (8A-1)
Aksanli, Baris (UCSD)   p. 384 (4D-3)
Al Faruque, Mohammad Abdullah (Univ. of California, Irvine)   p. 621 (7B-2)
Alarcon, Eduard (Univ. Politècnica de Catalunya)   p. 806 (9B-2)
Alvin, Joshua (Tokyo Inst. of Tech.)   p. 93 (2A-2)
Amano, Hideharu (Keio Univ.)   p. 103 (2A-7)
Amaru, Luca (Synopsys)   p. 530 (6C-2)
Amrouch, Hussam (Univ. of Stuttgart)   (2C-2)
Amrouch, Hussam (Karlsruhe Inst. of Tech.)   (3A-2)
Amrouch, Hussam (Univ. of Stuttgart)   p. 132 (2C-1)
Amrouch, Hussam (Karlsruhe Inst. of Tech.)   p. 189 (3A-1)
Anderson, Jason (Univ. of Toronto)   p. 260 (3D-3)
Anderson, Jason H. (Univ. of Toronto)   p. 481 (5D-3)
Andrade, Liliana (Univ. Grenoble Alpes, CNRS, Grenoble INP, TIMA)   p. 23 (1B-2)
Anik, Md Toufiq Hasan (Univ. of Maryland Baltimore County (UMBC))   p. 414 (4E-4)
Ankit, Aayush (Purdue Univ.)   p. 372 (4D-1)
Antunes, Rodrigo (Hewlett Packard Enterprise)   p. 372 (4D-1)
Arafin, Md Tanvir (Morgan State Univ.)   p. 120 (2B-3)
Arafin, Md Tanvir (Morgan State Univ.)   p. 449 (5C-2)
Ashjaei, Mohammad (Mälardalen Univ.)   p. 428 (5B-2)
Ayoub, Raid (Intel)   p. 561 (6E-1)

B

Baas, Bevan (Univ. of California, Davis)   p. 512 (6B-2)
Badaroux, Marie (Univ. Grenoble Alpes, CNRS, Grenoble INP, TIMA)   p. 325 (4B-2)
Bamberg, Lennart (GrAI Matter Labs)   p. 197 (3B-1)
Bao, Wei (Southeast Univ.)   p. 291 (3E-4)
Beck Rutzig, Mateus (Electronics and Computing Department - Federal Univ. of Santa Maria (UFSM))   p. 536 (6C-3)
Becker, Matthias (Royal Inst. of Tech.)   p. 428 (5B-2)
Beerel, Peter A. (Univ. of Southern California)   p. 344 (4C-1)
Bi, Yu (Univ. of Rhode Island)   p. 493 (5E-2)
Bianco, Carmine (Synopsys GmbH)   p. 331 (4B-3)
Boroumand, Sina (Imperial College London)   p. 524 (6C-1)
Bouganis, Christos-Savvas (Imperial College London)   p. 524 (6C-1)
Bouganis, Christos-Savvas (Imperial College London)   p. 703 (7E-3)
Bruel, Pedro (Univ. of São Paulo)   p. 372 (4D-1)
Burgholzer, Lukas (Johannes Kepler Univ. Linz)   p. 767 (8D-2)

C

Cai, Yi (Tsinghua Univ.)   p. 847 (9D-1)
Cai, Yuxuan (Northeastern Univ.)   p. 581 (7A-1)
Cao, Kun (Jinan Univ.)   p. 627 (7B-3)
Cao, Peng (South-east Univ.)   p. 272 (3E-1)
Cao, Peng (Southeast Univ.)   p. 291 (3E-4)
Carrion Schafer, Benjamin (Univ. of Texas, Dallas)   p. 542 (6D-1)
Carro, Luigi (Federal Univ. of Rio Grande do Sul)   p. 651 (7C-3)
Chakaravarthy, Ravikumar (Xilinx Inc)   p. 311 (4A-3)
Chakrabarty, Krishnendu (Duke Univ.)   (2K-2)
Chalamalasetti, Sai Rahul (Hewlett Packard Enterprise)   p. 372 (4D-1)
Chandra, Vikas (Facebook)   p. 599 (7A-4)
Chang, Hao-Ju (Yuan Ze Univ.)   p. 469 (5D-1)
Chang, Norman (Ansys)   p. 463 (5C-4)
Chang, Yuan-Hao (Academia Sinica)   p. 633 (7B-4)
Chang, Yuan-Hao (Academia Sinica)   p. 728 (8B-3)
Charot, François (Inria, Univ. Rennes, IRISA)   p. 338 (4B-4)
Chatterjee, Abhijit (Georgia Tech)   p. 140 (2D-1)
Chatterjee, Baibhab (Purdue Univ.)   p. 297 (4A-1)
Chatzigeorgiou, Chrysostomos (Univ. of Thessaly)   p. 773 (8D-3)
Chen, Chixiao (Fudan Univ.)   p. 13 (1A-7)
Chen, Congcong (Hunan Univ.)   p. 441 (5C-1)
Chen, Deming (Univ. of Illinois, Urbana-Champaign)   p. 358 (4C-3)
Chen, Deming (Univ. of Illinois, Urbana-Champaign)   p. 372 (4D-1)
Chen, Gary (National Taiwan Univ.)   p. 463 (5C-4)
Chen, Gengjie (Giga Design Automation)   p. 164 (2E-1)
Chen, Gengjie (Giga Design Automation)   p. 665 (7D-1)
Chen, Hua (Ansys)   p. 463 (5C-4)
Chen, Jianqi (Univ. of Texas, Dallas)   p. 542 (6D-1)
Chen, Jun (Osaka Univ.)   p. 284 (3E-3)
Chen, Kuan-Yu (National Tsing Hua Univ.)   p. 872 (9E-1)
Chen, Pei-Pei (National Tsing Hua Univ.)   p. 61 (1D-2)
Chen, Ping-Xiang (National Tsing Hua Univ.)   p. 728 (8B-3)
Chen, Shuo-Han (National Taipei Univ. of Tech.)   p. 728 (8B-3)
Chen, Tinghuan (Chinese Univ. of Hong Kong)   p. 898 (9E-5)
Chen, Xiaoming (Chinese Academy of Sciences)   p. 114 (2B-2)
Chen, Yen-Hao (National Tsing Hua Univ.)   p. 210 (3B-3)
Chen, Yi-Shen (National Taiwan Univ.)   p. 633 (7B-4)
Chen, Yiran (Duke Univ.)   p. 671 (7D-2)
Chen, Yung-Chih (Yuan Ze Univ.)   p. 61 (1D-2)
Chen, Yung-Chih (Yuan Ze Univ.)   p. 266 (3D-4)
Chen, Yung-Chih (Yuan Ze Univ.)   p. 469 (5D-1)
Chen, Zihao (Fudan Univ.)   p. 892 (9E-4)
Cheng, Chung-Kuan (Univ. of California, San Diego)   p. 170 (2E-2)
Cheng, Chung-Kuan (Univ. of California, San Diego)   p. 697 (7E-2)
Cheng, TaiYu (Osaka Univ.)   p. 284 (3E-3)
Cherupalli, Hari (Synopsys)   p. 318 (4B-1)
Chhabria, Vidya A. (Univ. of Minnesota)   p. 690 (7E-1)
Chi, Baoyong (Tsinghua Univ.)   p. 95 (2A-3)
Chia, Ben-Hau (National Taiwan Univ.)   p. 748 (8C-3)
Chien, Ruei-Ting (Georgia Tech)   p. 197 (3B-1)
Chiu, Hsien-Shih (Synopsys Taiwan)   p. 678 (7D-3)
Chow, Calvin (Ansys)   p. 463 (5C-4)
Cong, Thanh (Univ. Rennes, Inria, IRISA)   p. 338 (4B-4)
Constantinides, George (Imperial College London)   p. 524 (6C-1)
Coskun, Ayse K. (Boston Univ.)   p. 709 (7E-4)
Crafton, Brian (Georgia Tech)   p. 305 (4A-2)

D

Dao, Ai Quoc (National Chung Cheng Univ.)   p. 475 (5D-2)
Das, Anup (Drexel Univ.)   p. 657 (7C-4)
Davoodi, Azadeh (Univ. of Wisconsin-Madison)   p. 548 (6D-2)
De la Parra, Cecilia (Robert Bosch GmbH – Corporate Research)   p. 35 (1C-1)
De la Parra, Cecilia (Robert Bosch GmbH)   p. 365 (4C-4)
De Micheli, Giovanni (EPFL)   p. 779 (8E-1)
Deng, Chenhui (Cornell Univ.)   p. 152 (2D-3)
Deng, Wei (Tsinghua Univ.)   p. 95 (2A-3)
Dhar, Tonmoy (Univ. of Minnesota, Twin Cities)   p. 158 (2D-4)
Ding, Chuanming (East China Normal Univ.)   p. 645 (7C-2)
Dong, Peiyan (Northeastern Univ.)   p. 505 (6B-1)
Dong, Zhiyan (Fudan Univ.)   p. 13 (1A-7)
Drechsler, Rolf (Univ. of Bremen & DFKI GmbH)   p. 55 (1D-1)
Drechsler, Rolf (Univ. of Bremen/DFKI)   p. 67 (1D-3)
Drechsler, Rolf (Univ. of Bremen)   p. 574 (6E-3)
Drechsler, Rolf (Univ. of Bremen / DFKI GmbH)   p. 761 (8D-1)
Du, Qi (Xidian Univ.)   p. 665 (7D-1)
Duan, Yixiao (Duke Univ.)   p. 671 (7D-2)
Duwe, Henry (Iowa State Univ.)   p. 318 (4B-1)

E

Ebner, Philipp (Johannes Kepler Univ.)   p. 85 (1E-3)
Ebrahimi, Masoumeh (Royal Inst. of Tech.)   p. 819 (9B-4)
Ecco, Leonardo (Robert Bosch GmbH – Corporate Research)   p. 35 (1C-1)
Elshamy, Mohamed (Sorbonne Université, CNRS, LIP6)   p. 555 (6D-3)
Emerson, Joseph (Quantum Benchmark/Univ. of Waterloo)   (T1-1)
Ergun, Kazim (Univ. of California, San Diego)   p. 561 (6E-1)
Evmorfopoulos, Nestor (Univ. of Thessaly)   p. 773 (8D-3)

F

Fadaeinia, Bijan (Ruhr Univ. Bochum)   p. 414 (4E-4)
Fallon, Elias (Cadence Design Systems)   (T3-1)
Fan, Deliang (Arizona State Univ.)   p. 587 (7A-2)
Fan, Xiaoya (Northwestern Polytechnical Univ./Engineering Research Center of Embedded System
        Integration, Ministry of Education
)
  p. 798 (9B-1)
Fang, Shao-Yun (National Taiwan Univ. of Science and Tech.)   p. 678 (7D-3)
Faraboschi, Paolo (Hewlett Packard Enterprise)   p. 372 (4D-1)
Fernandez-Mesa, Breytner Joseph (Univ. Grenoble Alpes, CNRS, Grenoble INP, TIMA)   p. 23 (1B-2)
Fink, Gerold (Johannes Kepler Univ.)   p. 85 (1E-3)
Floros, George (Univ. of Thessaly)   p. 773 (8D-3)
Fojtik, Matthew (Nvidia)   p. 684 (7D-4)
Forlin, Bruno E. (Federal Univ. of Rio Grande do Sul)   p. 651 (7C-3)
Fu, Chia-Ching (National Taiwan Univ.)   p. 748 (8C-3)
Fu, Yuzhuo (Shanghai Jiao Tong Univ.)   p. 878 (9E-2)
Fujimura, Takuya (Tokyo Inst. of Tech.)   p. 3 (1A-2)
Fujita, Masahiro (Univ. of Tokyo)   p. 518 (6B-3)

G

Gaillardon, Pierre-Emmanuel (Univ. of Utah)   p. 530 (6C-2)
Gao, Di (Zhejiang Univ.)   p. 865 (9D-4)
Gao, Ruitao (Univ. of Tokyo)   p. 518 (6B-3)
Gao, Xiaohan (Peking Univ.)   p. 152 (2D-3)
Gao, Zhengqi (Fudan Univ.)   p. 892 (9E-4)
Garg, Siddharth (New York Univ.)   p. 885 (9E-3)
Garía-Ortiz, Alberto (Univ. of Bremen)   p. 197 (3B-1)
Garyfallou, Dimitrios (Univ. of Thessaly)   p. 773 (8D-3)
Gerstlauer, Andreas (Univ. of Texas, Austin)   (3A-4)
Gerstlauer, Andreas (Univ. of Texas, Austin)   p. 189 (3A-1)
Givargis, Tony (Univ. of California, Irvine)   p. 715 (8B-1)
Goli, Mehran (Univ. of Bremen/DFKI)   p. 67 (1D-3)
Goodchild, Chandran (Univ. of Freiburg)   p. 615 (7B-1)
Goto, Hayato (Toshiba)   (8A-2)
Große, Daniel (Johannes Kepler Univ. Linz)   p. 55 (1D-1)
Große, Daniel (Johannes Kepler Univ. Linz / DFKI GmbH)   p. 761 (8D-1)
Gruettner, Kim (OFFIS)   p. 17 (1B-1)
Gu, Huaxi (Xidian Univ.)   p. 853 (9D-2)
Gu, Jiangyuan (Tsinghua Univ.)   p. 204 (3B-2)
Gu, Jiangyuan (Tsinghua Univ.)   p. 229 (3C-2)
Gu, Xiaofan (Tokyo Inst. of Tech.)   p. 1 (1A-1)
Guirado, Robert (Univ. Politècnica de Catalunya)   p. 806 (9B-2)
Guntoro, Andre (Robert Bosch GmbH – Corporate Research)   p. 35 (1C-1)
Guntoro, Andre (Robert Bosch GmbH)   p. 365 (4C-4)
Guo, Kaiyuan (Tsinghua Univ.)   p. 734 (8C-1)
Guo, Xiaolong (Kansas State Univ.)   p. 396 (4E-1)
Guo, Yunhui (UCSD)   p. 384 (4D-3)
Gupta, Sandeep K. (Univ. of Southern California)   p. 29 (1B-3)
Gupta, Saransh (Univ. of California, San Diego)   p. 639 (7C-1)

H

Haaswijk, Winston (Cadence Design Systems)   p. 574 (6E-3)
Hajj, Izzat El (American Univ. of Beirut)   p. 372 (4D-1)
Hamada, Mototsugu (Univ. of Tokyo)   p. 97 (2A-4)
Hamada, Mototsugu (Univ. of Tokyo)   p. 99 (2A-5)
Hamidović, Medina (Johannes Kepler Univ.)   p. 85 (1E-3)
Han, Yinhe (Chinese Academy of Sciences)   p. 114 (2B-2)
Hao, Ge (Data Miracle Intelligent Technology)   (9A-1)
Hara-Azumi, Yuko (Tokyo Inst. of Tech.)   p. 260 (3D-3)
Harjani, Ramesh (Univ. of Minnesota, Twin Cities)   p. 158 (2D-4)
Hasanagić, Lamija (Mälardalen Univ.)   p. 428 (5B-2)
Haselmayr, Werner (Johannes Kepler Univ.)   p. 85 (1E-3)
Hashimoto, Masanori (Osaka Univ.)   p. 284 (3E-3)
Hassan, Muhammad (Univ. of Bremen)   p. 761 (8D-1)
Hattori, Wakaki (Ritsumeikan Univ.)   p. 786 (8E-2)
He, Yifan (Tsinghua Univ.)   p. 126 (2B-4)
He, Yifan (Tsinghua Univ.)   p. 813 (9B-3)
He, Zhuolun (Chinese Univ. of Hong Kong)   p. 833 (9C-2)
Hegde, Shashank (Univ. of Minnesota)   p. 318 (4B-1)
Henkel, Jörg (Karlsruhe Inst. of Tech.)   (3A-2)
Henkel, Jörg (Karlsruhe Inst. of Tech.)   p. 189 (3A-1)
Herdt, Vladimir (DFKI GmbH)   p. 55 (1D-1)
Hillmich, Stefan (Johannes Kepler Univ. Linz)   p. 792 (8E-3)
Hirano-Iwata, Ayumi (Tohoku Univ.)   (5A-4)
Hirose, Y. (Panasonic)   (6A-2)
Hirota, Yoshihiro (Tokyo Electron)   (T5-1)
Ho, Tsung-Yi (National Tsing Hua Univ.)   p. 73 (1E-1)
Ho, Tsung-Yi (National Tsing Hua Univ.)   p. 79 (1E-2)
Ho, Tsung-Yi (NTHU)   p. 278 (3E-2)
Ho, Tsung-Yi (National Tsing Hua Univ.)   p. 853 (9D-2)
Holtz, Chester (Univ. of California, San Diego)   p. 170 (2E-2)
Hosseini, Fateme (Univ. of Delaware)   p. 722 (8B-2)
Hsiao, Hsuan (Univ. of Toronto)   p. 260 (3D-3)
Hsu, Chin-Hsiung (Synopsys Taiwan)   p. 678 (7D-3)
Hu, Jiang (Texas A&M Univ.)   p. 158 (2D-4)
Hu, Jiang (Texas A&M Univ.)   p. 671 (7D-2)
Hu, Jingtong (Univ. of Pittsburgh)   p. 607 (7A-5)
Hu, Kai-Shun (Synopsys Taiwan)   p. 678 (7D-3)
Hu, X. Sharon (Univ. of Notre Dame)   p. 49 (1C-3)
Hu, Xiaobo Sharon (Univ. of Notre Dame)   (2C-3)
Hu, Xiaobo Sharon (Univ. of Notre Dame)   p. 132 (2C-1)
Huang, Chao (Northwestern Univ.)   p. 753 (8C-4)
Huang, Jiangli (Fudan Univ.)   p. 146 (2D-2)
Huang, Sitao (Univ. of Illinois, Urbana-Champaign)   p. 372 (4D-1)
Huang, Tsung-Wei (Univ. of Utah)   p. 278 (3E-2)
Huang, Yuxuan (Tsinghua Univ.)   p. 126 (2B-4)
Hwang, TingTing (National Tsing Hua Univ.)   p. 210 (3B-3)
Hwu, Wen-mei (Univ. of Illinois, Urbana-Champaign)   p. 372 (4D-1)

I

Imani, Mohsen (Univ. of California, Irvine)   (2C-4)
Imani, Mohsen (Univ. of California, Irvine)   p. 132 (2C-1)
Imani, Mohsen (UCSD)   p. 384 (4D-3)
Imani, Mohsen (Univ. of California, Irvine)   p. 639 (7C-1)
Inoue, A. (Panasonic)   (6A-2)
Inoue, Koji (Kyushu Univ.)   (5A-1)
Inoue, Toshiyuki (Univ. of Shiga Prefecture)   p. 15 (1A-8)
Ishida, Ryo (Shinshu Univ.)   p. 91 (2A-1)
Ishihara, Noboru (Tokyo Inst. of Tech.)   p. 5 (1A-3)
Ishii, M. (Panasonic)   (6A-2)
Ishikuro, Hiroki (Keio Univ.)   p. 9 (1A-5)
Ishikuro, Hiroki (Keio Univ.)   p. 11 (1A-6)
Ishikuro, Hiroki (Keio Univ.)   p. 105 (2A-8)
Isshiki, Yasuaki (Shinshu Univ.)   p. 91 (2A-1)
Ito, Hiroyuki (Tokyo Inst. of Tech.)   p. 5 (1A-3)
Ito, Hiroyuki (Tokyo Inst. of Tech.)   p. 101 (2A-6)
Iwasaki, Sho (Fujitsu Labs.)   (9A-4)

J

Jain, Palkesh (Qualcomm Technologies Inc)   p. 690 (7E-1)
Jeong, Geonhwa (Georgia Tech)   p. 197 (3B-1)
Jia, Haikun (Tsinghua Univ.)   p. 95 (2A-3)
Jia, Zhenge (Univ. of Pittsburgh)   p. 607 (7A-5)
Jiang, Hua (Xilinx Inc)   p. 311 (4A-3)
Jiang, Weiwen (Univ. of Notre Dame)   p. 593 (7A-3)
Jiao, Bo (Fudan Univ.)   p. 13 (1A-7)
Jiao, Ruochen (Northwestern Univ.)   p. 753 (8C-4)
Jin, Song (North China Electric Power Univ.)   p. 499 (5E-3)
Jin, Yier (Univ. of Florida)   p. 396 (4E-1)
Jo, Kyeongrok (Seoul National Univ.)   p. 183 (2E-4)
Jordan, Michael Guilherme (Institute of Informatics - Federal Univ. of Rio Grande do Sul (UFRGS))   p. 536 (6C-3)
Joseph, Jan Moritz (RWTH Aachen Univ.)   p. 197 (3B-1)
Jou, Jing-Yang (National Central Univ.)   p. 469 (5D-1)
Juan, Da-Cheng (National Tsing Hua Univ.)   p. 859 (9D-3)
Juan, Xiaobo (Univ. of Notre Dame)   p. 859 (9D-3)
Juneja, Rohan (Qualcomm)   p. 402 (4E-2)
Jung, Matthias (Fraunhofer IESE)   p. 35 (1C-1)
Jünger, Lukas (Institute for Communication Technologies and Embedded Systems, RWTH Aachen)   p. 331 (4B-3)

K

Kabe, T. (Panasonic)   (6A-2)
Kanazawa, Yuri (Hokkaido Univ.)   (6A-1)
Kandasamy, Nagarajan (Drexel Univ.)   p. 657 (7C-4)
Kanduri, Anil (Univ. of Turku)   p. 421 (5B-1)
Kang, Jaeyoung (UCSD)   p. 384 (4D-3)
Kang, Xiaoyang (Fudan Univ.)   p. 13 (1A-7)
Karimi, Naghmeh (Univ. of Maryland Baltimore County (UMBC))   p. 414 (4E-4)
Karimi, Naghmeh (Univ. of Maryland Baltimore County)   p. 455 (5C-3)
Karri, Ramesh (New York Univ.)   p. 885 (9E-3)
Kasuga, S. (Panasonic)   (6A-2)
Kayashima, Hideto (Keio Univ.)   p. 103 (2A-7)
Kemp, Taylor (Univ. of Wisconsin-Madison)   p. 248 (3D-1)
Khaleghi, Behnam (Univ. of California, San Diego)   p. 222 (3C-1)
Khoshavi, Navid (Florida Polytechnic Univ.)   p. 493 (5E-2)
Kim, Dong-Eun (Purdue Univ.)   p. 372 (4D-1)
Kim, Suwan (Seoul National Univ.)   p. 183 (2E-4)
Kim, Taewhan (Seoul National Univ.)   p. 183 (2E-4)
Kim, Yeseong (UCSD)   p. 384 (4D-3)
Kim, Yeseong (Daegu Gyeongbuk Inst. of Science and Tech.)   p. 639 (7C-1)
Kim, Younghyun (Univ. of Wisconsin-Madison)   p. 248 (3D-1)
Kishine, Keiji (Univ. of Shiga Prefecture)   p. 15 (1A-8)
Kondo, Satoshi (Toshiba)   (6A-3)
Korol, Guilherme (Institute of Informatics - Federal Univ. of Rio Grande do Sul (UFRGS))   p. 536 (6C-3)
Koshida, H. (Panasonic)   (6A-2)
Koyama, S. (Panasonic)   (6A-2)
Krishna, Tushar (Georgia Tech)   p. 197 (3B-1)
Krishna, Tushar (Georgia Tech)   p. 806 (9B-2)
Kueng, Richard (Johannes Kepler Univ. Linz)   p. 767 (8D-2)
Kumar, Akash (Technical Univ. of Dresden)   p. 365 (4C-4)
Kunal, Kishor (Univ. of Minnesota, Twin Cities)   p. 158 (2D-4)
Kundu, Souvik (Univ. of Southern California)   p. 344 (4C-1)
Kunikyo, T. (Panasonic)   (6A-2)
Kuo, Tei-Wei (National Taiwan Univ./City Univ. of Hong Kong)   p. 633 (7B-4)
Kuroda, Tadahiro (Univ. of Tokyo)   p. 97 (2A-4)
Kuroda, Tadahiro (Univ. of Tokyo)   p. 99 (2A-5)
Kwon, Hyoukjun (Georgia Tech)   p. 806 (9B-2)
Kwon, Hyun (Xilinx Inc)   p. 311 (4A-3)

L

Laguna, Ann Franchesca (Univ. of Notre Dame)   (2C-3)
Laguna, Ann Franchesca (Univ. of Notre Dame)   p. 49 (1C-3)
Laguna, Ann Franchesca (Univ. of Notre Dame)   p. 132 (2C-1)
Lai, Kuan-Ming (NTHU)   p. 278 (3E-2)
Lam, Siew-Kei (Nanyang Technological Univ.)   p. 402 (4E-2)
Lan, Shuyue (Northwestern Univ.)   p. 753 (8C-4)
Lau Neto, Walter (Univ. of Utah)   p. 530 (6C-2)
Le Nours, Sebastien (Univ. of Nantes)   p. 17 (1B-1)
Lee, Pei-Yu (MaxEDA)   p. 278 (3E-2)
Lee, Seogoo (Cadence)   (3A-4)
Lee, Siang-Yun (EPFL)   p. 779 (8E-1)
Lei, Jun Yang (Georgia Tech)   p. 140 (2D-1)
Leonhard, Julian (Sorbonne Université, CNRS, LIP6)   p. 555 (6D-3)
Leupers, Rainer (RWTH Aachen Univ.)   p. 197 (3B-1)
Leupers, Rainer (Institute for Communication Technologies and Embedded Systems, RWTH Aachen)   p. 331 (4B-3)
Li, Benzheng (Xidian Univ.)   p. 665 (7D-1)
Li, Bing (Tech. Univ. München)   p. 79 (1E-2)
Li, Bing (Capital Normal Univ.)   p. 487 (5E-1)
Li, Bing (Tech. Univ. of Munich)   p. 853 (9D-2)
Li, Can (Hewlett Packard Enterprise)   p. 372 (4D-1)
Li, Cheng (Tsinghua Univ.)   p. 204 (3B-2)
Li, Chuxi (Northwestern Polytechnical Univ./Engineering Research Center of Embedded System
        Integration, Ministry of Education
)
  p. 798 (9B-1)
Li, Hai (Duke Univ.)   p. 107 (2B-1)
Li, Hongjia (Northeastern Univ.)   p. 581 (7A-1)
Li, Meng (Facebook)   p. 599 (7A-4)
Li, Mengchu (Tech. Univ. of Munich)   p. 568 (6E-2)
Li, Qin (Tsinghua Univ.)   p. 505 (6B-1)
Li, Tao (Univ. of Florida)   p. 499 (5E-3)
Li, Wei (Chinese Univ. of Hong Kong)   p. 164 (2E-1)
Li, Yaguang (Texas A&M Univ.)   p. 158 (2D-4)
Li, Yilei (Facebook)   p. 599 (7A-4)
Li, Zhengang (Northeastern Univ.)   p. 581 (7A-1)
Liang, Hengyi (Northwestern Univ.)   p. 753 (8C-4)
Liang, Rongjian (Texas A&M Univ.)   p. 671 (7D-2)
Liang, Shuang (Tsinghua Univ.)   p. 734 (8C-1)
Liang, Yu-Pei (Academia Sinica)   p. 728 (8B-3)
Liao, Peiyu (Chinese Univ. of Hong Kong)   p. 833 (9C-2)
Liljeberg, Pasi (Univ. of Turku)   p. 421 (5B-1)
Lin, Chia-Chun (National Tsing Hua Univ.)   p. 61 (1D-2)
Lin, Chia-Chun (National Tsing Hua Univ.)   p. 266 (3D-4)
Lin, Chung-Wei (National Taiwan Univ.)   p. 748 (8C-3)
Lin, Lang (Ansys)   p. 463 (5C-4)
Lin, Mark Po-Hung (National Chiao Tung Univ.)   p. 475 (5D-2)
Lin, Ting-Chou (Univ. of California, San Diego)   p. 170 (2E-2)
Lin, Xue (Northeastern Univ.)   p. 581 (7A-1)
Lin, Yibo (Peking Univ.)   p. 152 (2D-3)
Lin, Yibo (Peking Univ.)   p. 825 (9C-1)
Lin, Yibo (Peking Univ.)   p. 833 (9C-2)
Liu, Bangan (Tokyo Inst. of Tech.)   p. 1 (1A-1)
Liu, Changlu (Tsinghua Univ.)   p. 505 (6B-1)
Liu, Changze (Hisilicon Technologies Co.)   p. 898 (9E-5)
Liu, Cheng (Chinese Academy of Sciences)   p. 487 (5E-1)
Liu, Dan (Univ. of California, San Diego)   p. 561 (6E-1)
Liu, Dingcheng (Xidian Univ.)   p. 665 (7D-1)
Liu, Kang (New York Univ.)   p. 885 (9E-3)
Liu, Leibo (Tsinghua Univ.)   p. 204 (3B-2)
Liu, Leibo (Tsinghua Univ.)   p. 229 (3C-2)
Liu, Mingjie (Univ. of Texas, Austin)   p. 152 (2D-3)
Liu, Ren-Shuo (National Tsing Hua Univ.)   p. 242 (3C-4)
Liu, Shaoshan (PerceptIn)   p. 742 (8C-2)
Liu, Siting (Chinese Univ. of Hong Kong)   p. 833 (9C-2)
Liu, Siting (Chinese Univ. of Hong Kong)   p. 885 (9E-3)
Liu, Ting (Shanghai Jiao Tong Univ.)   p. 878 (9E-2)
Liu, Xiangguo (Northwestern Univ.)   p. 753 (8C-4)
Liu, Yongpan (Tsinghua Univ.)   p. 126 (2B-4)
Liu, Yongpan (Tsinghua Univ.)   p. 813 (9B-3)
Lo, Yun-Chen (National Tsing Hua Univ.)   p. 79 (1E-2)
Louërat, Marie-Minerve (Sorbonne Université, CNRS, LIP6)   p. 555 (6D-3)
Lu, Tianyi (Novauto)   p. 734 (8C-1)
Lu, Zhaojun (Univ. of Maryland)   p. 120 (2B-3)
Lv, Hao (Chinese Academy of Sciences)   p. 487 (5E-1)
Lv, Yina (East China Normal Univ.)   p. 645 (7C-2)

M

Ma, Ruichang (Tsinghua Univ.)   p. 95 (2A-3)
Ma, Yu (ShanghaiTech Univ.)   p. 390 (4D-4)
Ma, Yuzhe (Chinese Univ. of Hong Kong)   p. 164 (2E-1)
Ma, Yuzhe (Chinese Univ. of Hong Kong)   p. 833 (9C-2)
Madhusudan, Meghna (Univ. of Minnesota, Twin Cities)   p. 158 (2D-4)
Mak, Wai-Kei (National Tsing Hua Univ.)   p. 872 (9E-1)
Mallappa, Uday (Univ. of California, San Diego)   p. 697 (7E-2)
Manasi, Susmita Dey (Univ. of Minnesota, Twin Cities)   p. 158 (2D-4)
Manasi, Susmita Dey (Univ. of Minnesota, Twin Cities)   p. 235 (3C-3)
Masuda, Yutaka (Nagoya Univ.)   p. 284 (3E-3)
Matsuo, Atsushi (IBM Research - Tokyo/Ritsumeikan Univ.)   p. 786 (8E-2)
Meng, Fanruo (Univ. of Delaware)   p. 722 (8B-2)
Mercati, Pietro (Intel)   p. 561 (6E-1)
Merrill, Devon (Univ. of California, San Diego)   p. 170 (2E-2)
Milojicic, Dejan (Hewlett Packard Enterprise)   p. 372 (4D-1)
Minati, Ludovico (Tokyo Inst. of Tech.)   p. 101 (2A-6)
Mirzaeian, Ali (George Mason Univ.)   p. 455 (5C-3)
Mishra, Prabhat (Univ. of Florida)   p. 408 (4E-3)
Mitani, Jun (Univ. of Tsukuba)   (3K-2)
Miura, Tsuyoshi (Tokyo Inst. of Tech.)   p. 3 (1A-2)
Miyaji, Kousuke (Shinshu Univ.)   p. 91 (2A-1)
Miyamoto, Koki (Tokyo Inst. of Tech.)   p. 5 (1A-3)
Momiyama, Yoichi (Socionext)   p. 284 (3E-3)
Montgomerie-Corcoran, Alexander (Imperial College London)   p. 703 (7E-3)
Moradi, Amir (Ruhr Univ. Bochum)   p. 414 (4E-4)
Mori, M. (Panasonic)   (6A-2)
Morris, Justin (UCSD)   p. 384 (4D-3)
Mu, Haoyuan (Tsinghua Univ.)   p. 351 (4C-2)
Mubeen, Saad (Mälardalen Univ.)   p. 428 (5B-2)
Murakawa, Shigemi (Zeon)   (T5-1)
Mutlu, Onur (ETH Zurich)   p. 657 (7C-4)

N

Nabavinejad, Seyed Morteza (Institute for Research in Fundamental Sciences (IPM))   p. 819 (9B-4)
Nagayama, Jun (Socionext)   p. 284 (3E-3)
Nakanishi, K. (Panasonic)   (6A-2)
Nam, Jae-Won (Seoul National Univ. of Science and Tech.)   p. 29 (1B-3)
Nazemi, Mahdi (Univ. of Southern California)   p. 344 (4C-1)
Nemtzow, Sean S. (Boston Univ.)   p. 709 (7E-4)
Neuhaus Lignati, Bernardo (Institute of Informatics - Federal Univ. of Rio Grande do Sul (UFRGS))   p. 536 (6C-3)
Niederholtmeyer, Kristof (Synopsys GmbH)   p. 331 (4B-3)
Niemier, Michael (Univ. of Notre Dame)   p. 49 (1C-3)
Niemier, Michael (Univ. of Notre Dame)   p. 132 (2C-1)
Niknia, Farzad (Univ. of Maryland Baltimore County)   p. 455 (5C-3)
Ning, Xuefei (Tsinghua Univ.)   p. 734 (8C-1)
Niu, Wei (College of William and Mary)   p. 581 (7A-1)
Nose, Y. (Panasonic)   (6A-2)

O

Odagawa, A. (Panasonic)   (6A-2)
Odema, Mohanad (Univ. of California, Irvine)   p. 621 (7B-2)
Okada, Kenichi (Tokyo Inst. of Tech.)   p. 1 (1A-1)
Okada, Kenichi (Tokyo Inst. of Tech.)   p. 3 (1A-2)
Okada, Kenichi (Tokyo Inst. of Tech.)   p. 7 (1A-4)
Okada, Kenichi (Tokyo Inst. of Tech.)   p. 93 (2A-2)
Okino, T. (Panasonic)   (6A-2)
Omori, Tatsuo (Univ. of Tokyo)   p. 97 (2A-4)
Omori, Tatsuo (Univ. of Tokyo)   p. 99 (2A-5)
Onishi, Ryo (Tokyo Inst. of Tech.)   p. 5 (1A-3)

P

Pan, David Z. (Univ. of Texas, Austin)   p. 152 (2D-3)
Pan, Junhao (Univ. of Illinois, Urbana-Champaign)   p. 358 (4C-3)
Pan, Stephen (Ansys)   p. 463 (5C-4)
Pan, Zhixin (Univ. of Florida)   p. 408 (4E-3)
Pang, Jian (Tokyo Inst. of Tech.)   p. 7 (1A-4)
Pang, Jian (Tokyo Inst. of Tech.)   p. 93 (2A-2)
Parameswaran, Sri (Univ. of New South Wales)   (3A-3)
Parameswaran, Sri (Univ. of New South Wales)   p. 189 (3A-1)
Park, Soowang (Univ. of Southern California)   p. 29 (1B-3)
Park, Sooyong (Sogang Univ.)   p. 79 (1E-2)
Parravicini, Alberto (Politecnico di Milano)   p. 378 (4D-2)
Patil, Nikhil (Qualcomm Technologies Inc)   p. 690 (7E-1)
Pavlidis, Vasilis F. (Univ. of Manchester)   p. 709 (7E-4)
Pedram, Massoud (Univ. of Southern California)   p. 344 (4C-1)
Peilin, Liu (Shanghai Jiao Tong Univ.)   (9A-1)
Petras, Dietmar (Synopsys GmbH)   p. 331 (4B-3)
Pétrot, Frédéric (Univ. Grenoble Alpes, CNRS, Grenoble INP, TIMA)   p. 23 (1B-2)
Pétrot, Frédéric (Univ. Grenoble Alpes, CNRS, Grenoble INP, TIMA)   p. 325 (4B-2)
Pillement, Sebastien (Univ. of Nantes)   p. 17 (1B-1)
Pionteck, Thilo (Otto-von-Guericke Univ. Magdeburg)   p. 197 (3B-1)
Poojary, Jitesh (Univ. of Minnesota, Twin Cities)   p. 158 (2D-4)
Prabhu, Ashwath (Qualcomm Technologies Inc)   p. 690 (7E-1)
Pui, Chak-Wa (Chinese Univ. of Hong Kong)   p. 176 (2E-3)

Q

Qiao, Fei (Tsinghua Univ.)   p. 505 (6B-1)
Qiu, Kaizhong (Tsinghua Univ.)   p. 847 (9D-1)
Qu, Gang (Univ. of Maryland)   p. 120 (2B-3)
Qu, Gang (Univ. of Maryland College Park)   p. 449 (5C-2)
Qu, Yuxiao (Chinese Univ. of Hong Kong)   p. 164 (2E-1)

R

Ragheb, Omar (Univ. of Toronto)   p. 481 (5D-3)
Rahmani, Amir M. (Univ. of California)   p. 421 (5B-1)
Rashid, Nafiul (Univ. of California, Irvine)   p. 621 (7B-2)
Raychowdhury, Arjit (Georgia Tech)   p. 305 (4A-2)
Reda, Sherief (Brown Univ.)   p. 819 (9B-4)
Reis, Dayane (Univ. of Notre Dame)   p. 49 (1C-3)
Ren, Bin (College of William and Mary)   p. 581 (7A-1)
Ren, Haoxing (Nvidia)   p. 684 (7D-4)
Riener, Heinz (EPFL)   p. 779 (8E-1)
Roohi, Arman (UNIVERSITY of NEBRASKA–LINCOLN)   p. 493 (5E-2)
Rosing, Tajana (Univ. of California, San Diego)   p. 222 (3C-1)
Rosing, Tajana (UCSD)   p. 384 (4D-3)
Rosing, Tajana (Univ. of California, San Diego)   p. 561 (6E-1)
Rosing, Tajana (Univ. of California, San Diego)   p. 639 (7C-1)
Roy, Kaushik (Purdue Univ.)   (1K-3)
Roy, Kaushik (Purdue Univ.)   p. 372 (4D-1)

S

Saadat, Hassaan (Univ. of New South Wales)   p. 189 (3A-1)
Saito, S. (Panasonic)   (6A-2)
Sakata, Y. (Panasonic)   (6A-2)
Salamat, Sahand (Univ. of California, San Diego)   p. 222 (3C-1)
Salamat, Sahand (UCSD)   p. 384 (4D-3)
Salman, Emre (Stony Brook Univ.)   p. 709 (7E-4)
San Miguel, Joshua (Univ. of Wisconsin-Madison)   p. 254 (3D-2)
San Miguel, Joshua (Univ. of Wisconsin-Madison)   p. 260 (3D-3)
Santambrogio, Marco Domenico (Politecnico di Milano)   p. 378 (4D-2)
Santos, Paulo Cesar (Federal Univ. of Rio Grande do Sul)   p. 651 (7C-3)
Sapatnekar, Sachin (Univ. of Minnesota, Twin Cities)   p. 158 (2D-4)
Sapatnekar, Sachin S. (Univ. of Minnesota, Twin Cities)   p. 235 (3C-3)
Sapatnekar, Sachin S. (Univ. of Minnesota)   p. 690 (7E-1)
Sarangi, Satyabrata (Univ. of California, Davis)   p. 512 (6B-2)
Sarangi, Smruti R. (Indian Inst. of Tech. Delhi)   p. 615 (7B-1)
Sargolzaei, Saman (Univ. of Tennessee at Martin)   p. 493 (5E-2)
Sartori, John (Univ. of Minnesota)   p. 318 (4B-1)
Sasan, Avesta (George Mason Univ.)   p. 455 (5C-3)
Sato, Shigeo (Tohoku Univ.)   (5A-4)
Sawada, M. (Panasonic)   (6A-2)
Schlichtmann, Ulf (Tech. Univ. of Munich)   p. 107 (2B-1)
Schlichtmann, Ulf (Tech. Univ. of Munich)   p. 568 (6E-2)
Schlichtmann, Ulf (Tech. Univ. of Munich)   p. 853 (9D-2)
Schneider Beck, Antonio Carlos (Institute of Informatics - Federal Univ. of Rio Grande do Sul (UFRGS))   p. 536 (6C-3)
Selvakumaran, Dinesh (Ansys)   p. 463 (5C-4)
Sen, Shreyas (Purdue Univ.)   p. 297 (4A-1)
Serebryakov, Sergey (Hewlett Packard Enterprise)   p. 372 (4D-1)
Sethumurugan, Subhash (Univ. of Minnesota)   p. 318 (4B-1)
Sgherzi, Francesco (Politecnico di Milano)   p. 378 (4D-2)
Sha, Edwin (East China Normal Univ.)   p. 645 (7C-2)
Shamsa, Elham (Univ. of Turku)   p. 421 (5B-1)
Shang, Siqi (Chinese Univ. of Hong Kong)   p. 435 (5B-3)
Shao, Zili (Chinese Univ. of Hong Kong)   p. 435 (5B-3)
Sharma, Arvind Kumar (Univ. of Minnesota, Twin Cities)   p. 158 (2D-4)
Shen, Chaoqun (Hunan Univ.)   p. 441 (5C-1)
Shen, Cindy Chin-Fang (Synopsys Taiwan)   p. 678 (7D-3)
Shen, Tianhao (Zhejiang Univ.)   p. 865 (9D-4)
Shi, Bin (Shanghai Jiao Tong Univ.)   p. 878 (9E-2)
Shi, Liang (East China Normal Univ.)   p. 645 (7C-2)
Shi, Longxing (South-east Univ.)   p. 272 (3E-1)
Shi, Xiao (Southeast Univ.)   p. 272 (3E-1)
Shi, Yiyu (Univ. of Notre Dame)   p. 593 (7A-3)
Shi, Yiyu (Univ. of Notre Dame)   p. 607 (7A-5)
Shi, Yiyu (Univ. of Notre Dame)   p. 853 (9D-2)
Shi, Yiyu (Univ. of Notre Dame)   p. 859 (9D-3)
Shiba, Kota (Univ. of Tokyo)   p. 97 (2A-4)
Shiba, Kota (Univ. of Tokyo)   p. 99 (2A-5)
Shibao, Zheng (Shanghai Jiao Tong Univ.)   (9A-3)
Shih, Nai-Ren (National Tsing Hua Univ.)   p. 73 (1E-1)
Shih, Wei-Kuan (National Tsing Hua Univ.)   p. 728 (8B-3)
Shiiki, Yohsuke (Keio Univ.)   p. 11 (1A-6)
Shin, Kwanwoo (Sogang Univ.)   p. 79 (1E-2)
Shirane, Atsushi (Tokyo Inst. of Tech.)   p. 1 (1A-1)
Shirane, Atsushi (Tokyo Inst. of Tech.)   p. 3 (1A-2)
Shirane, Atsushi (Tokyo Inst. of Tech.)   p. 7 (1A-4)
Shirane, Atsushi (Tokyo Inst. of Tech.)   p. 93 (2A-2)
Shirono, T. (Panasonic)   (6A-2)
Shubhi, Sumiran (Univ. of California, San Diego)   p. 222 (3C-1)
Shukla, Prachi (Boston Univ.)   p. 709 (7E-4)
Sill Torres, Frank (Department for the Resilience of Maritime Systems, DLR)   p. 574 (6E-3)
Silveira, Plinio (Hewlett Packard Enterprise)   p. 372 (4D-1)
Singla, Priyanka (Indian Inst. of Tech. Delhi)   p. 615 (7B-1)
Soliman, Taha (Robert Bosch GmbH – Corporate Research)   p. 35 (1C-1)
Song, Mingye (Tsinghua Univ.)   p. 841 (9C-3)
Song, Shihao (Drexel Univ.)   p. 657 (7C-4)
Song, Zheng (Tsinghua Univ.)   p. 95 (2A-3)
Spetalnick, Samuel (Georgia Tech)   p. 305 (4A-2)
Stamoulis, George (Univ. of Thessaly)   p. 773 (8D-3)
Stemmer, Ralf (OFFIS)   p. 17 (1B-1)
Strachan, John Paul (Hewlett Packard Enterprise)   p. 372 (4D-1)
Stratigopoulos, Haralampos-G. (Sorbonne Université, CNRS, LIP6)   p. 555 (6D-3)
Su, Yangfeng (Fudan Univ.)   p. 892 (9E-4)
Sudarshan, Chirag (Tech. Univ. Kaiserslautern)   p. 35 (1C-1)
Sugiura, Y. (Panasonic)   (6A-2)
Sun, Hanbo (Tsinghua Univ.)   p. 847 (9D-1)
Sun, Mengshu (Northeastern Univ.)   p. 581 (7A-1)
Sun, Qi (Chinese Univ. of Hong Kong)   p. 898 (9E-5)
Suu, Koukou (Ulvac Technologies)   (T5-1)
Suzuki, Dai (Shinshu Univ.)   p. 91 (2A-1)

T

Tai, Philip Hui-Yuh (Synopsys)   p. 678 (7D-3)
Takase, Hideki (Kyoto Univ./JST PRESTO)   (8A-3)
Takemoto, M. (Panasonic)   (6A-2)
Tam, Kit Seng (National Tsing Hua Univ.)   p. 266 (3D-4)
Tamaru, M. (Panasonic)   (6A-2)
Tan, Benjamin (New York Univ.)   p. 885 (9E-3)
Tan, Yi (Keio Univ.)   p. 11 (1A-6)
Tanaka, T. (Panasonic)   (6A-2)
Tang, Changcheng (Novauto)   p. 734 (8C-1)
Tang, Jie (South China Univ. of Tech.)   p. 742 (8C-2)
Tanimura, Shinya (Univ. of Shiga Prefecture)   p. 15 (1A-8)
Tao, Jun (Fudan Univ.)   p. 892 (9E-4)
Tempel, Sören (Univ. of Bremen)   p. 55 (1D-1)
Testa, Eleonora (EPFL)   p. 779 (8E-1)
Thomann, Simon (Karlsruhe Inst. of Tech.)   p. 132 (2C-1)
Tokgoz, Korkut K. (Tokyo Inst. of Tech.)   p. 3 (1A-2)
Tokgoz, Korkut Kaan (Tokyo Inst. of Tech.)   p. 5 (1A-3)
Tokgoz, Korkut Kaan (Tokyo Inst. of Tech.)   p. 101 (2A-6)
Tong, Dong (Peking Univ.)   p. 216 (3B-4)
Topaloglu, Rasit Onur (IBM)   p. 548 (6D-2)
Torazawa, N. (Panasonic)   (6A-2)
Toth, Peter (Keio Univ.)   p. 9 (1A-5)
Toth, Peter (Keio Univ.)   p. 105 (2A-8)
Trevisan Moreira, Matheus (Chronos Tech)   p. 530 (6C-2)
Trivedi, Kishor S. (Duke Univ.)   (T2-1)
Tseng, Tsun-Ming (Tech. Univ. of Munich)   p. 568 (6E-2)
Tsuchiya, Akira (Univ. of Shiga Prefecture)   p. 15 (1A-8)
Tsuchiya, Ryuta (Hitachi)   (5A-3)
Tsuji, Satomi (Hitachi)   (9A-2)

U

Usuda, M. (Panasonic)   (6A-2)
Utsunomiya, Henry H. (Interconnection Technologies)   (T4-1)

V

Vakil, Ashkan (George Mason Univ.)   p. 455 (5C-3)
Vidović, Tin (Mälardalen Univ.)   p. 428 (5B-2)
Vig, Saru (Nanyang Technological Univ.)   p. 402 (4E-2)
Vu, Hai-Dang (Univ. of Nantes)   p. 17 (1B-1)

W

Wakama, Toshiaki (Fujitsu Labs.)   (9A-4)
Walter, Marcel (Univ. of Bremen)   p. 574 (6E-3)
Wang, Chi-En (National Tsing Hua Univ.)   p. 242 (3C-4)
Wang, Chun (Tokyo Inst. of Tech.)   p. 1 (1A-1)
Wang, Chun-Yao (National Tsing Hua Univ.)   p. 61 (1D-2)
Wang, Chun-Yao (National Tsing Hua Univ.)   p. 266 (3D-4)
Wang, Danghui (Northwestern Polytechnical Univ./Engineering Research Center of Embedded System
        Integration, Ministry of Education
)
  p. 798 (9B-1)
Wang, Huandong (Loongson)   p. 216 (3B-4)
Wang, Kai (Southeast Univ.)   p. 291 (3E-4)
Wang, Miao (Northwestern Polytechnical Univ.)   p. 798 (9B-1)
Wang, Shunli (Fudan Univ.)   p. 13 (1A-7)
Wang, Tian (Nanjing Univ. of Science and Tech.)   p. 627 (7B-3)
Wang, Tianchen (Univ. of Notre Dame)   p. 853 (9D-2)
Wang, Tianyu (Chinese Univ. of Hong Kong)   p. 435 (5B-3)
Wang, Xiji (Nanjing Univ. of Science and Tech.)   p. 627 (7B-3)
Wang, Yanzhi (Northeastern Univ.)   p. 505 (6B-1)
Wang, Yanzhi (Northeastern Univ.)   p. 581 (7A-1)
Wang, Ying (Chinese Academy of Sciences)   p. 487 (5E-1)
Wang, Yixuan (Northwestern Univ.)   p. 753 (8C-4)
Wang, Yu (Tsinghua Univ.)   p. 734 (8C-1)
Wang, Yu (Tsinghua Univ.)   p. 847 (9D-1)
Wang, Yuhang (North China Electric Power Univ.)   p. 499 (5E-3)
Wang, Zhepeng (Univ. of Pittsburgh)   p. 607 (7A-5)
Wang, Zhilu (Northwestern Univ.)   p. 753 (8C-4)
Wehn, Norbert (Tech. Univ. Kaiserslautern)   p. 35 (1C-1)
Wei, Shaojun (Tsinghua Univ.)   p. 204 (3B-2)
Wei, Shaojun (Tsinghua Univ.)   p. 229 (3C-2)
Wei, Sheng-Hsiu (National Tsing Hua Univ.)   p. 61 (1D-2)
Weihang, Wang (Data Miracle Intelligent Technology)   (9A-1)
Weis, Christian (Tech. Univ. Kaiserslautern)   p. 35 (1C-1)
Wen, Jimin (Ansys)   p. 463 (5C-4)
Wille, Robert (Johannes Kepler Univ.)   p. 85 (1E-3)
Wille, Robert (Johannes Kepler Univ. Linz)   p. 574 (6E-3)
Wille, Robert (Johannes Kepler Univ. Linz)   p. 767 (8D-2)
Wille, Robert (Johannes Kepler Univ. Linz)   p. 792 (8E-3)
Wu, Allen (National Tsing Hua Univ.)   p. 210 (3B-3)
Wu, Chun-Feng (National Taiwan Univ./Academia Sinica)   p. 633 (7B-4)
Wu, Di (Univ. of Wisconsin-Madison)   p. 254 (3D-2)
Wu, Jun-Shen (National Tsing Hua Univ.)   p. 242 (3C-4)
Wu, Meng-Che (National Chung Cheng Univ.)   p. 475 (5D-2)
Wu, Qihong (Chinese Univ. of Hong Kong)   p. 435 (5B-3)
Wu, Yawen (Univ. of Pittsburgh)   p. 607 (7A-5)
Wu, Yen-Yi (Univ. of California, San Diego)   p. 170 (2E-2)
Wu, Yuping (Chinese Academy of Sciences)   p. 114 (2B-2)

X

Xia, Wenbo (Ansys)   p. 463 (5C-4)
Xie, Yu-Jin (National Tsing Hua Univ.)   p. 872 (9E-1)
Xie, Yuanyuan (Fudan Univ.)   p. 13 (1A-7)
Xie, Zhiyao (Duke Univ.)   p. 671 (7D-2)
Xiong, Jinjun (IBM)   p. 593 (7A-3)
Xu, Cong (Hewlett Packard Enterprise)   p. 372 (4D-1)
Xu, Qian (Univ. of Maryland College Park)   p. 449 (5C-2)
Xu, Shichao (Northwestern Univ.)   p. 753 (8C-4)
Xu, Xiaoqing (ARM Inc)   p. 671 (7D-2)
Xuan, Chengzhen (South-east Univ.)   p. 272 (3E-1)
Xue, Chun (City Univ. of Hong Kong)   p. 645 (7C-2)

Y

Yamada, S. (Panasonic)   (6A-2)
Yamada, Yutaka (Toshiba)   (6A-4)
Yamamoto, Hideaki (Tohoku Univ.)   (5A-4)
Yamaoka, Masanao (Hitachi)   (5A-2)
Yamashita, Shigeru (Ritsumeikan Univ.)   p. 786 (8E-2)
Yan, Changhao (Fudan Univ.)   p. 146 (2D-2)
Yan, Hao (South-east Univ.)   p. 272 (3E-1)
Yan, Zheyu (Univ. of Notre Dame)   p. 859 (9D-3)
Yanagisawa, Kiyoshi (Tokyo Inst. of Tech.)   p. 7 (1A-4)
Yang, Chengmo (Univ. of Delaware)   p. 722 (8B-2)
Yang, Diange (Tsinghua Univ.)   p. 734 (8C-1)
Yang, Dingcheng (Tsinghua Univ.)   p. 351 (4C-2)
Yang, Fan (Fudan Univ.)   p. 146 (2D-2)
Yang, Haoyu (Chinese Univ. of Hong Kong)   p. 885 (9E-3)
Yang, Huazhong (Tsinghua Univ.)   p. 126 (2B-4)
Yang, Huazhong (Tsinghua Univ.)   p. 505 (6B-1)
Yang, Huazhong (Tsinghua Univ.)   p. 734 (8C-1)
Yang, Huazhong (Tsinghua Univ.)   p. 813 (9B-3)
Yang, Huazhong (Tsinghua Univ.)   p. 847 (9D-1)
Yang, Li (Arizona State Univ.)   p. 587 (7A-2)
Yang, Ming (Tsinghua Univ.)   p. 841 (9C-3)
Yang, Tai (Southeast Univ.)   p. 291 (3E-4)
Yang, Zhao (Northwestern Polytechnical Univ.)   p. 798 (9B-1)
Yao, Gary (Case Western Reserve Univ.)   p. 351 (4C-2)
Yao, Yao (Univ. of Wisconsin-Madison)   p. 248 (3D-1)
Yen, Hsin-Ping (National Tsing Hua Univ.)   p. 61 (1D-2)
Yin, Ruokai (Univ. of Wisconsin-Madison)   p. 254 (3D-2)
Yin, Shouyi (Tsinghua Univ.)   p. 204 (3B-2)
Yin, Shouyi (Tsinghua Univ.)   p. 229 (3C-2)
Yin, Xunzhao (Zhejiang Univ.)   p. 132 (2C-1)
Yin, Xunzhao (Zhejiang Univ.)   p. 853 (9D-2)
You, Hailong (Xidian Univ.)   p. 665 (7D-1)
Young, Evangeline F.Y. (Chinese Univ. of Hong Kong)   p. 176 (2E-3)
Young, Evangeline F.Y. (Chinese Univ. of Hong Kong)   p. 885 (9E-3)
Yu, Bei (Chinese Univ. of Hong Kong)   p. 164 (2E-1)
Yu, Bei (Chinese Univ. of Hong Kong)   p. 833 (9C-2)
Yu, Bei (Chinese Univ. of Hong Kong)   p. 885 (9E-3)
Yu, Bei (Chinese Univ. of Hong Kong)   p. 898 (9E-5)
Yu, Bo (PerceptIn)   p. 742 (8C-2)
Yu, Cunxi (Univ. of Utah)   p. 530 (6C-2)
Yu, Huatao (Hisilicon Technologies Co.)   p. 898 (9E-5)
Yu, Jincheng (Tsinghua Univ.)   p. 734 (8C-1)
Yu, Mingfei (Univ. of Tokyo)   p. 518 (6B-3)
Yu, Tao-Chun (National Taiwan Univ. of Science and Tech.)   p. 678 (7D-3)
Yu, Wenjian (Tsinghua Univ.)   p. 351 (4C-2)
Yu, Wenjian (Tsinghua Univ.)   p. 841 (9C-3)
Yu, Zijie (Tsinghua Univ.)   p. 505 (6B-1)
Yuan, Geng (Northeastern Univ.)   p. 581 (7A-1)
Yuasa, Y. (Panasonic)   (6A-2)
Yue, Jinshan (Tsinghua Univ.)   p. 126 (2B-4)
Yue, Jinshan (Tsinghua Univ.)   p. 813 (9B-3)

Z

Zeng, Shulin (Tsinghua Univ.)   p. 734 (8C-1)
Zeng, Shulin (Tsinghua Univ.)   p. 847 (9D-1)
Zeng, Wei (Univ. of Wisconsin-Madison)   p. 548 (6D-2)
Zeng, Xuan (Fudan Univ.)   p. 146 (2D-2)
Zeng, Xuan (Fudan Univ.)   p. 892 (9E-4)
Zervakis, Georgios (Karlsruhe Inst. of Tech.)   (3A-2)
Zervakis, Georgios (Karlsruhe Inst. of Tech.)   p. 189 (3A-1)
Zhan, Canhui (Hisilicon Technologies Co.)   p. 898 (9E-5)
Zhang, Chenguang (ShanghaiTech Univ.)   p. 43 (1C-2)
Zhang, Gongxuan (Nanjing Univ. of Science and Tech.)   p. 627 (7B-3)
Zhang, Grace Li (Tech. Univ. of Munich)   p. 853 (9D-2)
Zhang, Jiliang (Hunan Univ.)   p. 441 (5C-1)
Zhang, Jingchong (Xidian Univ.)   p. 665 (7D-1)
Zhang, Jinshan (Fudan Univ.)   p. 13 (1A-7)
Zhang, Lei (Chinese Academy of Sciences)   p. 487 (5E-1)
Zhang, Li (Zhejiang Univ.)   p. 865 (9D-4)
Zhang, Lihua (Fudan Univ.)   p. 13 (1A-7)
Zhang, Meng (Northwestern Polytechnical Univ./Engineering Research Center of Embedded System
        Integration, Ministry of Education
)
  p. 798 (9B-1)
Zhang, Shengbing (Northwestern Polytechnical Univ./Engineering Research Center of Embedded System
        Integration, Ministry of Education
)
  p. 798 (9B-1)
Zhang, Shifan (Chinese Univ. of Hong Kong)   p. 885 (9E-3)
Zhang, Shuhang (Tech. Univ. of Munich)   p. 107 (2B-1)
Zhang, Song (Tsinghua Univ.)   p. 229 (3C-2)
Zhang, Xiaopeng (Chinese Univ. of Hong Kong)   p. 176 (2E-3)
Zhang, Xuan (Washington Univ. in St.Louis)   p. 396 (4E-1)
Zhang, Yan (Shanghai Jiao Tong Univ.)   p. 878 (9E-2)
Zhang, Yi (Tokyo Inst. of Tech.)   p. 7 (1A-4)
Zhang, Yuncheng (Tokyo Inst. of Tech.)   p. 1 (1A-1)
Zhang, Zhiru (Cornell Univ.)   p. 152 (2D-3)
Zhao, Jishen (Univ. of California, San Diego)   p. 865 (9D-4)
Zheng, Dan (Chinese Univ. of Hong Kong)   p. 176 (2E-3)
Zheng, Li-Cheng (National Central Univ.)   p. 469 (5D-1)
Zheng, Zhidan (Tech. Univ. of Munich)   p. 568 (6E-2)
Zhigang, Chang (Shanghai Jiao Tong Univ.)   (9A-3)
Zhou, Bo (East China Normal Univ.)   p. 645 (7C-2)
Zhou, Dian (UT Dallas)   p. 146 (2D-2)
Zhou, Dian (Univ. of Texas, Dallas)   p. 892 (9E-4)
Zhou, Junlong (Nanjing Univ. of Science and Tech.)   p. 627 (7B-3)
Zhou, Minxuan (Univ. of California, San Diego)   p. 639 (7C-1)
Zhou, Pingqiang (ShanghaiTech Univ.)   p. 43 (1C-2)
Zhou, Pingqiang (ShanghaiTech Univ.)   p. 390 (4D-4)
Zhou, Shuxin (Chinese Academy of Sciences/Univ. of Chinese Academy of Sciences)   p. 216 (3B-4)
Zhu, Deqi (Ansys)   p. 463 (5C-4)
Zhu, Haozhe (Fudan Univ.)   p. 13 (1A-7)
Zhu, Huifeng (Washington Univ. in St.Louis)   p. 396 (4E-1)
Zhu, Qi (Northwestern Univ.)   p. 753 (8C-4)
Zhu, Ying (Tech. Univ. of Munich)   p. 853 (9D-2)
Zhu, Zhenhua (Tsinghua Univ.)   p. 847 (9D-1)
Zhuge, Qingfeng (East China Normal Univ.)   p. 645 (7C-2)
Zhuo, Cheng (Zhejiang Univ.)   p. 132 (2C-1)
Zhuo, Cheng (Zhejiang Univ.)   p. 853 (9D-2)
Zhuo, Cheng (Zhejiang Univ.)   p. 865 (9D-4)
Zulehner, Alwin (Johannes Kepler Univ. Linz)   p. 792 (8E-3)