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The 23rd International Technical Conference on Circuits/Systems, Computers and Communications

Session E7  EMI & EMC- RF Circuits & Components
Time: 13:00 - 14:12 Wednesday, July 9, 2008
Location: 8F 802 Room
Chairs: Koichi Tanno (Faculty of Engineering, University of Miyazaki, Japan), Young Yun (Korea Maritime University, Republic of Korea)

E7-1 (Time: 13:00 - 13:18)
TitleHighly Miniaturized RF Components Employing Metamaterial Structure on MMIC
AuthorHan-Nah Joh, *Young-Bae Park, Se-Ho Kim, Young Yun (Korea Maritime University, Republic of Korea)
Pagepp. 881 - 884
KeywordRF passive components, metamaterial, MMIC
AbstractIn this study, we introduce highly miniaturized on-chip impedance transformer and Wilkinson power divider, which were fabricated using metamaterial structure on MMIC. Concretely, a microstrip line employing metamaterial was used for a fabrication of the RF passive components. The size of the impedance transformer and power divider were reduced to 2.3 and 6 % of the conventional one, respectively.

E7-2 (Time: 13:18 - 13:36)
TitleMiniaturized Active Balun MMIC Employing Active Device
Author*Young-Bae Park, Se-Ho Kim, Han-Nah Joh, Young Yun (Korea Maritime University, Republic of Korea), Kyu-Ho Park, Kwang-Ho Ahn (Korea Electronics Technology Institute, Republic of Korea)
Pagepp. 885 - 888
Keywordactive balun, MMIC, power coupling, InGaP/GaAs HBT
AbstractIn this paper, miniaturized active baluns employing active device were proposed. The miniaturized active baluns were fabricated employing InGaP/GaAs HBT (heterojunction bipolar transistor) on GaAs substrate for MMIC applications, and especially a composite structure employing common-emitter (CE) and common-collector (CC) circuits was used for 90° power coupling. The size of the active balun for power coupling was about 1.9 % of conventional passive branch-line coupler. The active baluns for power coupling showed good RF performances comparable to passive branch-line couplers.

E7-3 (Time: 13:36 - 13:54)
TitleMiniaturized RF Components Employing π-type Multiple Coupled Microstrip Line Structure
AuthorSe-Ho Kim, *Young-Bae Park, Han-Nah Joh, Young Yun (Department of Radio Communication Engineering, Korea Maritime University, Republic of Korea), Kyu-Ho Park, Kwang-Ho Ahn (Korea Electronics Technology Institute, Republic of Korea)
Pagepp. 889 - 892
KeywordWilkinson power divider, PPGM, MMIC
AbstractIn this work, using a π-type multiple coupled microstrip line structure (MCMLS), we fabricated highly miniaturized Wilkinson power divider and branch-line coupler. The line length of the Wilkinson power divider and branch-line coupler were reduced to about λ/44 and λ/38, respectively, and their size were 11.2 % and 14.6 % of conventional ones, respectively. The miniaturized Wilkinson power divider and branch-line coupler showed good RF performances in C band.

E7-4 (Time: 13:54 - 14:12)
TitleCommon-Mode Current of a PCB to Cable and Its Suppression of the Radiated Emission by Decoupling Capacitor
AuthorKi-bum Jung, *Min-Seok Han (Hanyang University, Republic of Korea), Yeon-choon Chung (Seokyeong University, Republic of Korea), Jaehoon Choi (Hanyang University, Republic of Korea)
Pagepp. 893 - 896
KeywordPCB, EMI , Common-Mode Current, Signal Integrity
AbstractDecoupling capacitors on packages and printed circuit boards are often essential to reduce voltage fluctuation and maintain power and signal integrity. This paper presents the effect of decoupling capacitor on signal integrity and radiated emission about critical trace change by reference plane. It was observed that the decoupling capacitor is not to enhance signal integrity but to reduce the unnecessary radiation.