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APCOM'07-EPMESC XI
Third Asian-Pacific Congress on Computational Mechanics in conjunction with
Eleventh International Conference on the Enhancement and Promotion of Computational Methods in Engineering and Science

Session MS8-1  Computational Mechanics for Electronic Devices/ Components (Sponsored by the 21st Century COE Program for Research and Education on Complex Functional Mechanical Systems, Kyoto University)
Time: 10:40 - 12:30 Tuesday, December 4, 2007
Location: 1F Annex 1
Chair: Chris John Bailey (Univ. of Greenwich, United Kingdom)

MS8-1-1 (Time: 10:40 - 11:15)
Title[Keynote] Reliability Assessment of Electronic Packaging with Hybrid Approach of Experimental and Computational Mechanics
Author*Soon-Bok Lee, Ilho Kim (KAIST)

MS8-1-2 (Time: 11:15 - 11:40)
TitleThe evaluation and optimization of tape casting process for multi layered chip inductor
Author*Giho Jeong, Changsik Park (Samsung Electro-Mechanics)

MS8-1-3 (Time: 11:40 - 12:05)
TitleDrift-Diffusion Device Simulation of Stress-Induced Effect on Electronic Characteristics of nMOSFETs
Author*Masaaki Koganemaru (Fukuoka Industrial Technology Center), Toru Ikeda, Noriyuki Miyazaki (Kyoto Univ.), Hajime Tomokage (Fukuoka Univ.)

MS8-1-4 (Time: 12:05 - 12:30)
TitleThermal stress analysis and geometric optimization of a heater module
AuthorKengo Fujiki, *Keiji Ogi, Nagatoshi Okabe (Ehime Univ.)