10:30-11:20 |
¡ý |
title | Understanding Atomic Layer Deposited HfO2 as a Gate Dielectric: Theory of Growth, and Scaling |
author(s) | M. L. Green, M. A. Alam, G. D. Wilk (Agere Systems), M. -Y. Ho (National University of Singapore) |
|
11:20-12:10 |
¡ý |
Âê̾ | 50nm°Ê²¼¤ÎÎΰè¤Ø¤Î£Ã£Í£Ï£Ó¤Î¥¹¥±¡¼¥ê¥ó¥°¤È¤½¤Î¤¿¤á¤ÎɬÍ×¥×¥í¥»¥¹µ»½Ñ |
Ãø¼Ô | ´ä°æ ÍÎ (Åìµþ¹©¶ÈÂç³Ø ¥Õ¥í¥ó¥Æ¥£¥¢ÁϤ¶¦Æ±¸¦µæ¥»¥ó¥¿¡¼) |
title | CMOS Scaling towards Sub-50nm and Required Process Technologies |
author(s) | Hiroshi Iwai (Tokyo Inst. Technol.) |
|
Ãë¿© |
13:00-13:35 |
¡û |
Âê̾ | 90nm¥Î¡¼¥É¤ÎÄãÂÔµ¡»þ¾ÃÈñÅÅÎÏÍÑÅÓ(Low Standby Power)HfO2¥²¡¼¥ÈÀä±ïËìCMOS |
Ãø¼Ô | Pidin Sergey, ¿¹ºê Í´Êå, ÆþÌî À¶, Ãæ¼ ͧ¥Ë, ¿ù°æ ¼÷Çî (ÉÙ»ÎÄ̸¦µæ½ê¡¡C¥×¥í¥¸¥§¥¯¥ÈÉô ¥Ç¥Ð¥¤¥¹³«È¯Éô) |
title | Low Standby Power CMOS with HfO2 Gate Dielectric for 90nm Generation |
author(s) | S. Pidin, Y. Morisaki, K. Irino, T. Nakamura, T. Sugii (Fujitsu laboratories) |
|
13:35-13:55 |
|
Âê̾ | ¹â²¹Ç®½èÍý¤Ë¤è¤ëHf-Silicate MISFET¤Î°ÜÆ°ÅÙ¤ÎÎô²½ |
Ãø¼Ô | »³¸ý ¹ë, ÈÓÅç Îɲð, °æÌî ¹±ÍÎ, À¾»³ ¾´, Ê¡Åç ¿, º´ÃÝ ½¨´î ((³ô)Åì¼Ç ¸¦µæ³«È¯¥»¥ó¥¿¡¼) |
title | Degradation of Mobility in Hf-silicate MISFETs due to High Temperature Annealing |
author(s) | Takeshi Yamaguchi, Ryosuke Iijima, Tsunehiro Ino, Akira Nishiyama, Noburu Fukushima, Hideki Satake (Toshiba Corporation R&D center) |
|
13:55-14:30 |
¡û |
Âê̾ | CVD-HfO2¤Î¹½Â¤²òÀϤȿ®ÍêÀ |
Ãø¼Ô | ¸¶ÅÄ ²Â¾°, 𱩠Àµ¾¼ (¾¾²¼ÅŴﻺ¶È¡Ê³ô¡ËȾƳÂμÒ), Sungjoo Lee (The University of Texas at Austin), Dim-Lee Kwong (Matsushita Elec., Univ. Texas at Austin) |
title | Specific Structural Factors Influencing on Reliability of CVD-HfO2 |
author(s) | Yoshinao Harada, Masaaki Niwa (Micro Electronics Research Center), Sungjoo Lee (The University of Texas at Austin), Dim-Lee Kwong (Matsushita Elec./Univ. Texas at Austin) |
|
14:30-14:50 |
|
Âê̾ | Hf¥·¥ê¥±¡¼¥ÈËì¤ÎÇ®½èÍý¤Ë¤è¤ëÎô²½µÚ¤ÓÃâÁÇź²Ã¤Ë¤è¤ëÂÑÇ®À¸þ¾å |
Ãø¼Ô | À¾»³ ¾´, ¾®»³ Àµ¿Í, °æÌî ¹±¹°, ÈÓÅç Îɲð, »³¸ý ¹ë, ¾®ÃÓ Àµ¹À, ³ùÅÄ Á±¸Ê, ¶â»Ò ÌÀÀ¸, ¾®Ìî ¿ð¾ë, ¾å̶ÅÄ Íº°ì, ÎëÌÚ ÀµÆ», ¹âÅç ¾Ï ((³ô)Åì¼Ç ¸¦µæ³«È¯¥»¥ó¥¿¡¼) |
title | Degradation of the Hf-silicates with High-temperature Annealing and the Enhancement of the Thermal Stability by Nitrogen Incorporation in the Film |
author(s) | Akira Nishiyama, Masato Koyama, Tsunehiro Ino, Ryosuke Iijima, T. Yamaguchi, Masahiro Koike, Yoshiki Kamata, Akio Kaneko, Mizuki Ono, Yuichi Kamimuta, Masamichi Suzuki, Akira Takashima (Corporate R&D Center, Toshiba Corp.) |
|
µÙ·Æ |
15:10-15:45 |
¡û |
title | Compositional Dependence of Direct Tunneling in Transition Metal and Rare Earth Silicate Alloys: A Criterion for Selection of High-k Alternative Dielectrics for Advanced CMOS Devices |
author(s) | G. Lucovsky (Departments of Physics, NC State University, Raleigh, NC, USA) |
|
15:45-16:05 |
|
Âê̾ | ¹âͶÅÅΨÀä±ïËìºàÎÁ¤Î·ë¾½²½¤Ë´Ø¤¹¤ë¸ÅŵŪʬ»ÒÆ°Îϳإ·¥ß¥å¥ì¡¼¥·¥ç¥ó |
Ãø¼Ô | ¾®ºä ͵»Ò, »³ºê δ¹À, ¶âÅÄ ÀéÊæ»Ò (ÉÙ»ÎÄ̸¦µæ½ê) |
title | Molecular Dynamic Simulation on the Crystallization of High-K Gate Dielectric Materials |
author(s) | Yuko Kosaka, Takahiro Yamasaki, Chioko Kaneta (Fujitsu laboratories Ltd.) |
|
16:05-16:25 |
|
Âê̾ | ʬ»ÒÁØÀ©¸æCVDAlOx:NËì¤ÎʪÀµÚ¤ÓÅŵ¤ÅªÆÃÀɾ²Á |
Ãø¼Ô | ¿Ü»³ ÆÆ»Ö, »³²¬ ¿¿º¸Â§, ¼¾å ½¨¼ù, µÜºê À¿°ì (¹ÅçÂç³Ø) |
title | Characterization of Aluminum-Oxynitride Gate Dielectrics Formed by Layer-by-Layer CVD |
author(s) | Atsushi Suyama, Masanori Yamaoka, Hideki Murakami, Seiichi Miyazaki (Hiroshima University) |
|
16:25-17:15 |
¡ý |
title | Physical Characterization of Ultrathin High-K Dielectrics |
author(s) | W. Vandervorst, B. Brijs, T. Conard, O. Richard, H. Bender, J. Petry, C. Zhao (IMEC) |
|
17:15-18:20 |
|
¥Ñ¥Í¥ë¥»¥Ã¥·¥ç¥ó¡Ö¼¡À¤Â好¥ê¥å¡¼¥·¥ç¥ó¤Ï²¿¡©¥ª¡¼¥¬¥Ê¥¤¥¶¡¼¡¡Ê¿Ã«ÀµÉ§¡ÊÆüΩ¡Ë¡¢ÅÏÉôÊ¿»Ê¡ÊNEC¡Ë¡¢Ã°±©Àµ¾¼¡Ê¾¾²¼
|
18:20-20:00 |
|
ͼ¿©¡¦º©¿Æ²ñ |
20:00-22:00 |
|
¥Ý¥¹¥¿¡¼¥»¥Ã¥·¥ç¥ó |
8:30-9:20 |
¡ý |
Âê̾ | Èó¾½¼ÁSiO2Ãæ¤ÎÏĤó¤ÀSi-O-Si·ë¹ç¤ÎʪÍýŪ¡¦²½³ØŪ±þÅú |
Ãø¼Ô | °ÀÄÅ ¹À°ì (»º¶Èµ»½ÑÁí¹ç¸¦µæ½ê), ÀîÉû Çî»Ê (HOYA) |
title | Reactions of Strained Si-O-Si Bonds in a-SiO2 Materials Induced by Physical and Chemical Perturbations |
author(s) | Koichi Awazu (AIST), Hiroshi Kawazoe (HOYA) |
|
9:20-9:55 |
¡û |
Âê̾ | »ÀÁÇ¥ê¥Ã¥Á³¦ÌÌÁؤòͤ¹¤ë¶ËÇöÃâ²½¥·¥ê¥³¥ó¥²¡¼¥ÈÀä±ïËì |
Ãø¼Ô | ÄÔÀî ¿¿Ê¿, Êö ÍøÇ·, ÅèËÜ ÂÙÍÎ, ³°Â¼ ½¤, ÅÚ²° ζÂÀ, ÂçÀ¾ ÏÂÇî, ßÀ¼ ¹À¹§, Ä»µï ϸù, ÈøÆâ µý͵, ͳ¾å ÆóϺ (ÆüΩÀ½ºî½ê Ãæ±û¸¦µæ½ê) |
title | An Ultra-Thin Silicon Nitride Gate Dielectric with Oxygen-Enriched Interface (OI-SiN) |
author(s) | S. Tsujikawa, T. Mine, Y. Shimamoto, O. Tonomura, R. Tsuchiya, K. Ohnishi, H. Hamamura, K. Torii, T. Onai, J. Yugami (Hitachi) |
|
9:55-10:15 |
|
Âê̾ | ¹â¿®Íꥲ¡¼¥ÈÀä±ïËì¤È¤·¤Æ¤Î¥é¥¸¥«¥ëÃâ²½»À²½Ëì |
Ãø¼Ô | °æ¾å ¿¿Íº, ´Ý»³ ¾Íµ± (»°É©Åŵ¡(³ô) ULSIµ»½Ñ³«È¯¥»¥ó¥¿¡¼), ²ÏÀ¥ ϲí (»°É©Åŵ¡(³ô) Àèüµ»½ÑÁí¹ç¸¦µæ½ê), ÇßÅÄ ¹À»Ê, ÂçÌî µÈÏ (»°É©Åŵ¡(³ô) ULSIµ»½Ñ³«È¯¥»¥ó¥¿¡¼) |
title | Radical Nitrided Oxide for Highly Reliable Gate Dielectric |
author(s) | Masao Inoue, Yoshiki Maruyama (ULSI Development Center, Mitsubishi Electric Co.), Kazumasa Kawase (Advanced Technology R&D Center, Mitsubishi Electric Co.), Hiroshi Umeda, Yoshikazu Ohno (ULSI Development Center, Mitsubishi Electric Co.) |
|
µÙ·Æ |
10:30-11:05 |
¡û |
Âê̾ | ¥é¥¸¥«¥ëÃâ²½¤òÍѤ¤¤¿¶ËÇö¥²¡¼¥ÈÀä±ïËì¤Î·ÁÀ® |
Ãø¼Ô | ´Øº¬ ¹î¹Ô, ¸¤µÜ À¿¼£, Ê¡°æ Âç¿, ¹âÌø ËüΤ»Ò, ¿åÅç °ìϺ, ¹ËÅç ¾Íδ (³ô¼°²ñ¼ÒÅì¼Ç¥»¥ß¥³¥ó¥À¥¯¥¿¡¼¼Ò¡¡¥×¥í¥»¥¹µ»½Ñ¿ä¿Ê¥»¥ó¥¿¡¼) |
title | Formation of Ultra-thin Gate Dielectrics by Radical Nitridation Process |
author(s) | K. Sekine, S. Inumiya, H. Fukui, M. Takayanagi, I. Mizushima, Y. Tsunashima (Toshiba) |
|
11:05-11:40 |
¡û |
Âê̾ | Êü¼Í¸÷¸÷ÅÅ»Òʬ¸÷¤Ë¤è¤ë¶ËÇöÀä±ïËì/Si³¦Ì̤ιâʬ²ò²òÀÏ |
Ãø¼Ô | ÈøÅè Àµ¼£, ¾®Ìî ´²ÂÀ, ²¬ÎÓ ½á, ËÅÄ ÃÒ»Ë, ±ü¼ ̳, ÌÚ¼ ¹áΤ, ÁÈƬ ¹»Ö (ÅìÂ繩), Ê¿²¼ µªÉ×, 𱩠Àµ¾¼, ±±ÅÄ ¹¨¼£ (STARC) |
title | High-resolution Analysis of Ultrathin Insulator Film/Si Interfaces by Synchrotron Radiation Photoelectron Spectroscopy |
author(s) | M. Oshima, K. Ono, J. Okabayashi, S. Toyoda, T. Okumura, K. Kimura, H. Kumigashira (Univ. Tokyo), N.Hirashita, M. Niwa, H. Usuda (STARC) |
|
11:40-12:15 |
¡û |
Âê̾ | ¹â²¹»À²½»þ¤Î¥·¥ê¥³¥ó¡¿»À²½Ë쳦ÌÌÈ¿±þµ¡¹½ |
Ãø¼Ô | Èø¿È Çîͺ, David J. Bottomley, ¾®ÎÓ ·Ä͵, ¿¢¾¾ ¿¿»Ê, ±ÆÅç ÇîÇ·, ²®Ìî ½ÓϺ (NTTʪÀ²Ê³Ø´ðÁø¦µæ½ê) |
title | Kinetics of High-Temperature Thermal Silicon Oxidation at the SiO2/Si Interface |
author(s) | H. Omi, David J. Bottomley, Y. Kobayashi, M. Uematsu, H. Kageshima, T. Ogino (NTT) |
|
Ãë¿© |
13:00-13:20 |
|
Âê̾ | Ç®¥·¥ê¥³¥ó»À²½ËìÃæ¤Ë»Ä¸¤¹¤ëÃá½ø |
Ãø¼Ô | ä¼ ¸÷²ð, ÅÏîµ ¹§¿®, »³ºê ÂçÊå (Áá°ðÅÄÂç³ØÍý¹©³ØÉô), »Ö¼ ¹Í¸ù (ÂçºåÂç³ØÂç³Ø±¡¹©³Ø¸¦µæ²Ê), ÇßÌî ÀµÎ´ (Ê¡°æ¹©¶ÈÂç³Ø¹©³ØÉô), ÂçÇñ ´à (Áá°ðÅÄÂç³ØÍý¹©³ØÉô¡¢Áá°ðÅÄÂç³Ø³Æ̳µÇ°ºàÎÁµ»½Ñ¸¦µæ½ê) |
title | Residual Order within Thermal Oxide Films Grown on Crystalline Silicon |
author(s) | Kosuke Tatsumura, Takanobu Watanabe, Daisuke Yamasaki (School of Science and Engineering, Waseda University), Takayoshi Shimura (Graduate School of Engineering, Osaka University), Masataka Umeno (Faculty of Engineering, Fukui University of Technology), Iwao Ohdomari (School of Science and Engineering, Waseda University & Kagami Memorial Laboratory for Materials Science and Technology, Waseda University) |
|
13:20-13:40 |
|
Âê̾ | SiO2Ãæ¤Ë¤ª¤±¤ëB¤Î³È»¶µ¡¹½ |
Ãø¼Ô | Âçë ¼Â, ÇòÀÐ ¸Æó, ²¡»³ ½ß (ÃÞÇÈÂç³Ø ʪÍý³Ø·Ï) |
title | Diffusion Mechanisms of B in SiO2 |
author(s) | Minoru Otani, Kenji Shiraishi, Atsushi Oshiyama (Tsukuba Univ. Institute of Physics) |
|
13:40-14:30 |
¡ý |
title | Breakdown and Reliability of Ultra-thin MOS Devices |
author(s) | Jordi Sune (Departament d'Enginyeria Electronica, Universitat Autonoma de Barcelona, ETSE (Edifici C)), Ernest Y. Wu, Wing L.Lai, David Jimenez (IBM Microelectronics Division) |
|
14:30-14:50 |
|
Âê̾ | ¶ËÇö¥²¡¼¥ÈÀä±ïËì¤ÎNBTÎô²½¤È¤½¤Îµ¡¹½ |
Ãø¼Ô | »°Ã« Í´°ìϺ, ĹÎæ ¿¿, º´ÃÝ ½¨´î ((³ô)Åì¼Ç¸¦µæ³«È¯¥»¥ó¥¿¡¼LSI´ðÈ×µ»½Ñ¥é¥Ü¥é¥È¥ê¡¼), Ä»³¤ ÌÀ (ÅìµþÂç³ØÂç³Ø±¡¹©³Ø·Ï¸¦µæ²Ê) |
title | A Study on Mechanism of Negative Bias Temperature Instability in Ultrathin Gate Oxides |
author(s) | Yuichiro Mitani, Makoto Nagamine, Hideki Satake (Advanced LSI Technology Laboratory, Toshiba Corporation), Akira Toriumi (Department of Materials Science, The University of Tokyo) |
|
14:50-15:10 |
|
Âê̾ | SIMOX¥¦¥§¥Ï¤Ë¤ª¤±¤ë¥²¡¼¥È»À²½Ëì¤Î¿®ÍêÀ²òÀÏ |
Ãø¼Ô | ÄÔÆâ ´´É×, ´ä¾¾ ½ÓÌÀ, À®²¬ ±Ñ¼ù, ÇßÅÄ ¹À»Ê, °ìË¡»Õ δ»Ö, Á°Àî ÈËÅÐ, °æ¾å Ì÷ϯ (»°É©Åŵ¡ ULSIµ»½Ñ³«È¯¥»¥ó¥¿¡¼) |
title | Analysis of Gate Oxide Breakdown on SIMOX Wafer |
author(s) | Mikio Tsujiuchi, Toshiaki Iwamatsu, Hideki Naruoka, Hiroshi Umeda, Takashi Ipposhi, Shigeto Maegawa, Yasuo Inoue (Mitsubishi Electric Corporation,ULSI Development Center) |
|
µÙ·Æ |
15:30-16:05 |
¡û |
Âê̾ | »À²½Ë줪¤è¤Ó»À²½Ëì/¥·¥ê¥³¥ó³¦Ì̥ȥé¥Ã¥×¤Ëµ¯°ø¤·¤¿·Ð»þÅÅή²òÀÏ |
Ãø¼Ô | ͳ¾åÆóϺ, »³ÅÄÎ÷°ì ((³ô)ÆüΩÀ½ºî½êÃæ±û¸¦µæ½ê) |
title | Analysis of the Transient Current due to Oxide Traps and Interface Traps |
author(s) | J. Yugami, R. Yamada (Hitachi, Ltd., Central Research Laboratory) |
|
16:05-16:40 |
¡û |
title | Mechanisms of Negative-Bias Temperature Instability of SiO2/Si and SiON/Si Systems |
author(s) | Shinji Fujieda, Yoshinao Miura, Koichi Terashima , Shigeru Kimura, Koji Masuzaki (Silicon Systems Research Laboratories, NEC Corporation), Ziyuan Liu (NEC Electronics), Markus Wilde, Katsuyuki Fukutani (Institute of Industrial Science, University of Tokyo) |
|
Âê̾ | ¥×¥é¥º¥Þ»À²½¡¢Ãâ²½¤Ë¤è¤ë¥²¡¼¥ÈÀä±ïËìÃæ¤Ë´Þ¤Þ¤ì¤ë´õ¥¬¥¹¸¶»Ò¤¬Åŵ¤ÅªÆÃÀ¤ËÍ¿¤¨¤ë±Æ¶Á |
Ãø¼Ô | ¿Ûˬ ÃÒÇ· (ÅìËÌÂç³ØÂç³Ø±¡¹©³Ø¸¦µæ²ÊÅŻҹ©³ØÀ칶), Èõ¸ý Àµ¸² (ÅìËÌÂç³ØÂç³Ø±¡¹©³Ø¸¦µæ²Êµ»½Ñ¼Ò²ñ¥·¥¹¥Æ¥àÀ칶), ÂçÅè °ìϺ, Äø¥¤Åó (ÅìËÌÂç³ØÂç³Ø±¡¹©³Ø¸¦µæ²ÊÅŻҹ©³ØÀ칶), »ûËÜ ¾Ï¿, Ê¿»³ ¾»¼ù (ÅìËÌÂç³Ø̤Íè²Ê³Øµ»½Ñ¶¦Æ±¸¦µæ¥»¥ó¥¿¡¼), ¿ÜÀî À®Íø (ÅìËÌÂç³ØÂç³Ø±¡¹©³Ø¸¦µæ²Êµ»½Ñ¼Ò²ñ¥·¥¹¥Æ¥àÀ칶), Â縫 Ãé¹° (ÅìËÌÂç³Ø̤Íè²Ê³Øµ»½Ñ¶¦Æ±¸¦µæ¥»¥ó¥¿¡¼) |
title | Influence of the Noble Gas Atom Contained in the Plasma Oxides and Nitrides on the Electrical Properties |
author(s) | Tomoyuki Suwa (Department of Electronic Engineering, Graduate School of Engineering, Tohoku University), Masaaki Higuchi (Department of Management of Science & Technology, Graduate School of Engineering, Tohoku University), Ichiro Ohshima, Cheng Weitao (Department of Electronic Engineering, Graduate School of Engineering, Tohoku University), Akinobu Teramoto, Masaki Hirayama (New Industry Creation Hatchery Center ,Tohoku University), Shigetoshi Sugawa (Department of Management of Science & Technology, Graduate School of Engineering, Tohoku University), Tadahiro Ohmi (New Industry Creation Hatchery Center ,Tohoku University) |